BGA Assembly

BGA Assembly is the specialized SMT process for mounting Ball Grid Array packages, ensuring reliable hidden solder joints beneath high-I/O components like processors, FPGAs, and chipsets. It includes precise solder paste printing, automated placement with fiducial alignment, controlled reflow profiling, and mandatory X-ray inspection (2D/3D) to verify voiding, bridging, and ball alignment. Our BGA capabilities feature nitrogen reflow, real-time thermal monitoring, and automated repair/reball stations—delivering ≥99.5% yield on fine-pitch (0.4 mm) BGAs with full IPC-610 Class 3 compliance and lot-level traceability. This ensures robust performance in high-reliability applications from prototypes to volume. Ready for void-free, high-density BGA assembly? Get in touch today!

Manufacturing Metrics

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BGA Assembly

Reflow Soldering

Following the component placement, the assembled PCB board goes through the soldering oven, where the high temperature gradually melts the paste and attaches the electronic components to the board. These are long convection ovens with a process length of more than 6 meters, separated into 10 heating zones and cooling zones. Preheat, thermal soak, reflow, and cooling are the four stages into which the zones are split. Solder profiles can be optimized for each particular assembly job based on the component size and layout, layer counts on the PCB, and copper distribution on the board. The oven's heating zones are each set at a controlled temperature that corresponds to the solder profiles needed for assembly. After heating the component and its attachment to the board, follow the cooling process. The solder paste will harden as soon as the temperature decreases significantly, and the components are then attached to the circuit board. In the final areas of the reflow oven, where the processed board is cooling, the solder alloy solidifies and forms the solder joints. After reflow soldering, the PCB board goes to the loader, which performs two functions. It can act as a buffer for the boards that are waiting for checking, or it can be used to cool down the board after reflow soldering.

BGA Assembly

Partial X-Ray Inspection

AOI cannot evaluate the quality of soldered components like BGA, LGA, or CSP. Our X-ray inspection device performs further inspections on boards containing these components. Usually, an AOI specialist operates the X-ray machine. Not all PCB boards are tested since the X-ray process takes time. The estimated number of boards is examined depending on the project and partners needs. In order to verify ideal reflow and process setup, our machine can inspect concealed solder junctions, check the selective soldering and rework, and perform failure analysis.