Service Flow

Service Flow in SMT manufacturing is the optimized sequence that transforms bare PCBs and components into fully tested assemblies through solder paste printing, high-speed placement, reflow soldering, AOI, electrical testing, cleaning/coating, final assembly, and packaging. Effective Service Flow eliminates bottlenecks, embeds inline quality checks for early defect detection, and enables rapid changeovers using SMED principles and modular equipment. By aligning takt times, optimizing feeder setups, and applying kanban-based replenishment, we deliver higher first-pass yields, reduced rework, and agile mixed-model production. Ideal for high-variety, low-volume runs. Ready for flexible, high-quality SMT assembly? Let's build it together.

Manufacturing Metrics

All of our services have different metrics. We've aimed to unify and better present the capabilities of our manufacturing services through a standardized approach.

Service Flow

Solder Paste Preparation

To protect PCBs from harsh conditions while in use, we have conformal coating equipment. Conformal coating is a thin, protective layer applied to PCBs to safeguard them from various environmental factors. It is a crucial component in ensuring the reliability and longevity of PCBs, especially in harsh or demanding environments such as medical, industrial, or IoT industries. At our facility, PCB loading, coating, curing, and unloading are all fully automated and inline processes. We utilize a non-volatile UV coating that cures quickly in UV light. Precise coating coordinates identify spots that need coating or should be left uncoated. Numerous coating nozzles ensure accurate filling and application.

Service Flow

PCB Laser Engraving

Every printed circuit board — the backbone of any electronic device — must be coded and labeled to ensure full traceability and quality control throughout the manufacturing process. While there are several methods for marking PCBs, we have found laser marking to be the most efficient. This method provides high-contrast, precise markings, saves both time and energy, and avoids any contamination of the board's solder joints or circuitry. At our facility, we use a CO₂ laser marking system for PCB engraving. This equipment includes a fiducial mark recognition feature, PCB orientation verification, program-controlled conveyor width adjustment, and an integrated inverter that enables double-sided marking. The option to engrave design features such as a logo is also available with this system. Additionally, we recently acquired inline lasers. They are made to mark PCB boards as they move along the assembly line, speeding up production. By scanning the data matrix code, every manufacturing step can be tracked, ensuring full process traceability and consistent PCB quality.

Service Flow

Stencil Cutting

For quick solder paste application, stainless steel stencils are used. The stencil layout includes surface mount device (SMD) footprints, via which the solder paste is pressed in the screen-printing process. Since the stencil is cut according to the PCB board design, it has to be altered if any changes or improvements occur in the project. Most often, we use 100- or 120-micron stainless steel stencils to apply the right amount of solder paste to the pads. Due to the high cost of the laser equipment used to cut the stencils, electronics manufacturing companies often outsource the stencil production. To make the new product introduction stage shorter, we have a cutting laser at our facility. So, our engineers can create and cut a new stencil in-house for a new project or its improvement. We use two types of stencil cutters. They offer high flexibility with aperture modifications, engraving logos, part numbers, or matrix codes. Our newer edition of the laser cutter precisely uses argon gas to join two different metal sheets, allowing us to create step stencils. This enables us to develop advanced PCB board designs and improve the soldering procedure.